Precision rolled materials for assemblies (gold-tin alloy solder pastes, cladded materials)
Mitsubishi Materials' precision processing material for assembly, which features high accuracy and a high melting point.
Mitsubishi Materials supplies AuSn paste, a precision processing material for assembly, for bonding or sealing applications involving precision components. It features high accuracy and high melting point.
ElectronicsMetal Materials & Manufactured Goods
Features
- High accuracy and high melting point
- Lower cost through the batch processing of printing and reflow (heat-treatment), etc.
- Available for dispensing and pin transfer
- Excellent wettability
- Capable of bonding small parts which are not easy to bond using preform foil materials.
- No high costs for metal molds
- Higher thermal conductivity and bond strength than thermosetting Ag epoxy resin
- Easily able to form electrode bumps
Applications
- Die bonding (high brightness LEDs, peltier elements and power semiconductors) for vehicle installations, lighting, thermoelectric exchange modules and other applications.
- Sealing (liquid crystal and SAW devices) for mobile communications, base stations, MEMS sensors and others.
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