Equipment industry

Grain Stabilized Oxygen-Free Copper for Metal Ceramic Substrates for Power Electronics (OFC)

High strength and heat resistant oxygen-free copper (OFC)

High purity copper ~6N,7N(6N8)grade~

Alternative to BeCu (C17200) & Cu-Ti (C1990) - high conductivity, high strength copper alloy

Copper electrolysis related equipment

Smelting-related parts and materials

Copper materials (including Oxygen-free copper, Copper alloys, Strips, Sheets and Busbars)

Cemented carbide rotary die cutter (anvil roll)

Precision rolled materials for assemblies (gold-tin alloy solder pastes, cladded materials)

Dielectric thin film fabrication materials

Copper anodes (copper balls) for plating

Chemical products

Corrosion-resistant alloys

Heat-resistant alloys

Controlled expansion alloys

Aluminum products

Finished special alloy products (facilities, equipment, parts)

High Performance Seals & Packing Products (For Vacuum, Semiconductors, Automotive, Pneumatic, etc.)