Copper anodes (copper balls) for plating
We use only selected electrolytic copper materials to provide top-level products that generate little sludge.
We provide materials for plating techniques including printed circuit board plating and steel plating.
Because we use only selected electrolytic copper, minute crystals are evenly distributed, ensuring uniform melting and higher current efficiency.
Metal Materials & Manufactured Goods
Features
We use only selected electrolytic copper materials to provide top-level products that generate little sludge.
Minute crystals distributed evenly ensures uniform melting and higher current efficiency.
Applications
- Printed circuit board plating
- Steel plating
- Cylinder rolls for gravure printing
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