Copper electrolysis related equipment
Our copper electrolysis-related equipment has been used in many copper refineries both in Japan and overseas.In addition to the following equipment, we also handle anode scrap cleaning equipment, cathode cleaning equipment and negative plate finishing machines.
[Product line]
- Negative plate debonding machine
- Loop slitting line
- Anode straightener
- Motherboard polishing machine
Industrial Equipment, Smelting Technology Products, and Auxiliary MaterialsIndustrial Equipment, Smelting Technology Products, and Auxiliary MaterialsOur Focus Products
Features
Copper electrolysis equipment (e.g., negative plate finishing machines and anode straighteners)
This copper electrolysis-related device was developed, improved and begun to be used practically by Mitsubishi Materials Corporation to enable the copper smelters of its Group to increase their productivity.
The equipment has been delivered to domestic and overseas copper smelters based on copper electrolysis-related equipment that is already in practical use.
Applications
Devices handled and applications
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Device |
Applications | ||
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Negative plate debonding machine |
The device debonds copper plates (negative plates) electrodeposited onto cathode plates. |
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Loop slitting line |
This device cuts a copper plate into pieces of copper of the specific size called a loop. Loops connect negative plates to crossbars to suspend them. |
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Negative plate finishing machine |
This device assembles loops and crossbars for the suspension on negative plates. Embossing presses provide verticality to negative plates. |
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Anode straightener |
This device deforms the "handle" of copper anodes by pressing on them to improve verticality. |
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Anode scrap cleaning equipment |
This device washes away electrolytic solution and slime remaining on scrap anodes using high-pressure high-temperature water. |  |
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Cathode cleaning equipment |
This device washes the surface of cathodes using high-temperature water. |  |
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Motherboard polishing machine |
This device polishes the surfaces of cathode base plates. Users can select the intensity, area and roughness of polishing. |  |